Volume packages
Assembling your photonic integrated circuits (PICs) or micro-electromechanical systems (MEMS) into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as Silicon Photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.
If possible, we would like to start collaborating with you at an early stage of your PIC design. The early involvement of our experts can be crucial for the optimal performance, cost and manufacturability of your module, in small batches and in high volumes.Â
PHIX Butterfly
Our butterfly package is well-suited for a compact and well-sealed integrated photonics enabled device with a modest number of inputs and outputs. If your module needs RF electronics, have a look at our other butterflies or Large Area Gold Box. The latter is also great for large optical I/O counts. More specifications can be found in our standard package types table.
PHIX Butterfly XL
At the cost of some DC connections, our PHIX Butterfly XL offers two medium speed (up to 15 GHz) RF connections and in most cases has room for a spot size converting fiber array. In addition, its hermetic fiber feed-through makes this package suitable for full hermeticity.
XLMD-MSA Butterfly
The XLMD-MSA butterfly is our most compact standard package. Despite its modest number of available connections, it provides two convenient SMPM connectors for RF electrical signals. More specifications can be found in our standard package types table.
Large Area Gold Box
This sturdy gold box package is great for housing your PIC-enabled module as part of a larger system. Although it only has one facet for optical I/O, up to 64 fibers can be used. The opposite facet is dedicated to up to 8 channels of high performance RF electrical interfacing. More specifications can be found in our standard package types table.
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LCP Overmolded Leadframe
The liquid crystal polymer (LCP) overmolded leadframe is a customizable butterfly shaped housing that is suitable for panel-level assembly. Although the polymer enclosure only supports partial hermeticity, this material and the way it is molded around the leadframe significantly lowers the cost per unit in medium to high volume production. More specifications can be found in our standard package types table.
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Custom package
If you have specific needs that do not fit our standard packages, we can make modifications to them or even design a custom package for you. We have designed custom solutions for many markets and our engineers are ready to support your technology.
Contract manufacturing
If you already have a housing for your package, PHIX can help you with your volume assembly by the outsourcing or second-sourcing of your production. We can optimize your designs for maximum manufacturability and scale-up flexibility, and can develop the processes needed for the production of your modules.
More specifications of our standard package types can be found in this table (new window).
Download our Design Guidelines (.pdf)
To help you optimize your PIC design for low-cost and low-risk packaging and select the most suitable standardized package type, we offer you our PHIX Design Guidelines document as a free download.
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