PHIX RF Characterization Package
The PHIX RF Characterization Package is an open architecture prototyping package for photonic integrated circuits (PICs) with radio frequency (RF) electrical connectivity options. Using off-the-shelf building blocks and standardized production processes, this fast and affordable packaging solution turns the PIC into an optoelectronic module by providing a housing with DC and RF electrical connections, optical interfaces, and thermal management options. Besides highly standardized, this development platform is also very flexible, supporting PICs of different sizes and material platforms.
Key features
- PICs of 4 to 20 mm and of several material platforms are supported.
- Interfaces:
- 1 optical (east)
- up to 2 DC electrical (north and south)
- 1 RF electrical (west)
- Up to 16 independent RF channels optimized for GSG configuration.
- Edge coupled SM or PM fiber array with up to 32 I/Os.
- Optional spot size converters for mode field matching of edge coupled optical interfaces.
- Two fan-out printed circuit boards (PCBs) with 60 DC electrical contacts each.
Module building blocks
The PHIX RF Characterization Package is built around a gold-plated copper base that carries the PIC, fiber array strain reliefs, printed circuit boards (PCBs), and spacers for the transparent cover plate.
Optional PHIX Cooling Carrier XL
The PHIX RF Characterization Package is fitted with an NTC thermistor inside its gold-plated copper base, which allows temperature measurement of the PIC. The PHIX Cooling Carrier XL is an optional expansion that allows the temperature to be controlled using two 20W thermoelectric coolers (TECs). The Cooling Carrier XL is attached below the module and has a convenient mounting plate for connection to an optical table. Using a TEC controller (not included) the temperature of the PIC can be kept at a constant value.
Design rules documentation
In order to benefit from the affordability and short lead times that the PHIX RF Characterization Package offers, your chip design must adhere to some specific design rules. Conformity with these rules allows PHIX to make use of standardized (and automated) production processes and off-the-shelf building blocks. The design rules for the PHIX RF Characterization Package build on the PIC Design Guidelines document that describes good design practices for all package types. We highly recommend that you download and study both documents.
Download documents
Please complete the form to be taken to a page where you can download documentation and other support files.
Other package types
If you suspect that other packages types may be a better fit for your project, please review our standard package types table.