NEWS
Company news and blog
PHIX develops innovative packaging solutions for ultra-high speed hybrid PICs in PATTERN project
September 19th 2022 The Horizon Europe project PATTERN will develop the world’s first Process and Assembly Design Kits (PDK & ADK) for microwave photonics at ultra‐high frequencies (100+ GHz) as well as new methods or heterogeneous integration of III-V gain...
Read our white paper on spot size converters
PHIX is pleased to offer you a free white paper about spot size converters (SSCs). By improving the mode field matching, these optional extensions to our fiber arrays greatly reduce coupling losses between optical fibers and photonic integrated circuits. Our free...
Pull testing for wire bonding process optimization
Wire bonding is a common, but very important, process for connecting photonic integrated circuits (PICs) with their surrounding electronics. The recently acquired Royce Instruments 620 pull-shear tester allows PHIX to pinpoint weaknesses in the process and...
PHIX is ready for the next phase of growth through additional investments and expansion of facilities
Enschede, The Netherlands, July 27th 2022 To continue to support our customers, PHIX is proud to have secured €3 million in new capital for the short term and €20 million for the long term from the National Growth Fund. In addition, PHIX will occupy a new building...
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