NEWS
Company news and blog
News december 2019
Looking forward - a few words from CEO Albert HasperPrototype Package including Spot Size Converter (SSC ) Fiber Arrays with mode field 4.2 x 3.2 µm @ 1550nm, assembled to InP chipDear All, It has only been a little more than one year when PHIX started its...
Kickoff EU H2020 project TERAWAY, PHIX Photonics Assembly to performing packaging of Thz photonic modules
Project Launch – Kick-off meeting The implementation of TERAWAY project was officially inaugurated with the kick-off meeting that took place on 3rd and 4th of December 2019. All the twelve (12) members of the consortium were gathered for a two-day productive...
PHIX Photonics Assembly and TEEM Photonics join forces to scale up Spot Size Converter assembly manufacturing
TEEM Photonics glass Waveguide Array to Fiber Transposer (WAFT) allows users to make an efficient coupling from small mode field diameter Photonic Integrated Circuits (PIC) to Single Mode fibers using its proprietary glass ion exchange technology. Combined with the...
PHIX and Tyndall Institute strengthen their collaboration
PHIX Photonics assembly (PHIX) and PIXAPP Pilot Line Coordinator Tyndall Institute have strengthened their collaboration in the development of the photonic packaging ecosystem by arranging dedicated training of PHIX engineers on Tyndall’s...
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