September 18th 2024 Latitude Design Systems has updated their PIC Studio design software with an Assembly Design Kit (ADK) for the PHIX Characterization Package. This ADK helps designers of photonic integrated circuits comply with the design rules for this packaging...
September 11th 2024 Jeroen Duis becomes Chief Technology Officer of PHIX The technology roadmap of PHIX is closely matched to the industry trends and customer needs that help us reach our ambitious goals. To further improve the synergy between our technological and...
July 10th 2024 Based on patented PHIX technology for integrating bulk optics with photonic integrated circuits (PICs), PHIX assembled a proof-of-concept optical isolator building block for the lithium niobate platform. One of the goals of the Horizon Europe PATTERN...
May 14th 2024 From June 3rd 2024 PHIX will occupy a new building in Enschede, The Netherlands, which is fully tailored to our integrated photonics and MEMS packaging operations and a further scale-up to volume manufacturing. Our new home at Kennispark TwenteWith 1800...
April 11th 2024 Our customer Light Trace Photonics is using a PHIX package as part of a programmable system for educating the photonics engineers of the future. Plug-and-play exploration of photonic chip technologyLight Trace Photonics is a Bristol (UK) based company...
November 27th, 2023 As an extension to PHIX's participation in The Netherlands and Flanders Mission to the United States, our CCO Jeroen Duis is traveling to several innovation hotspots in the US. He is available for in-person meetings to share PHIX's world leading...
November 6th 2023 Luceda Photonics has launched an Assembly Design Kit (ADK) for the PHIX Characterization Package. This ADK is now available in their IPKISS design software for photonic integrated circuits.The implementation of this PHIX ADK in the Luceda Photonics...
September 28th, 2023 The PHIX Characterization Package has received a major update, increasing both its level of standardization and its flexibility as a development platform for photonic integrated circuits (PICs). The PHIX Characterization Package is an open...
In collaboration with Surfix Diagnostics, PHIX is pleased to offer you a white paper about the wafer level manufacturing of photonic biosensors with integrated active components. As part of this work, PHIX demonstrates flip chip integration of III-V photonic...