PHIX Characterization Package Support
Here you will find support resources for our PHIX Characterization Package for photonic integrated circuits.
Quick Start Guide
In this video our process engineer David van Duinen shows you how to unpack, handle, and connect your PHIX Characterization Package. He covers topics such as basic module layout, connectivity, thermal management, and safe handling. The video is also a good first introduction to this integrated photonics packaging platform.
Please note that this video refers to an older version of the PHIX Characterization Package and may not be entirely up to date.
Frequently Asked Questions (FAQ)
How are the modules shipped to me safely?
Your modules are packaged individually in ESD-safe boxes. The module is screwed onto a base plate and specially formed foam is used to safely coil the fibers and hold the fiber connectors in place.
How do I safely unpack and handle a module?
If your modules are sensitive to ESD (electrostatic discharge), make sure you open the boxes in an ESD-safe area with the necessary precautions in place. When removing a module from its box, it’s best to start by freeing the fiber connectors from the foam, uncoiling the fibers, and putting them to the side of the box. Make sure not to bend the fibers to a radius smaller than that of the foam supports in the box. Next, unscrew the module from its base plate.
When picking up the module, hold it by its copper mount, not by the fiber strain relief brackets. A plastic lid protects the chip and the wire bonds from accidental touching. Please be aware that particularly the wire bonds are very fragile.
How to connect the electronics?
Our Characterization Packages are fitted with connectors for flexible flat cables (FFCs). At the other end of the FFCs you can use fan-out boards to connect to your electronic equipment.
The pin layout of the PCBs (and therefore of the FFCs) can be specific for each project. Therefore, these specifications will have been sent by email to the contact person for the project within your organization.
What thermal management options are available?
The gold plated copper mount of the PHIX Characterization Package is very thermally conductive and will therefore passively dissipate the heat generated on your chip. If your application requires it, we can also offer active cooling. This can be achieved using our optional PHIX Cooling Carrier in combination with the NTC thermistor placed inside the copper mount. If you’d like to know more about how this looks, please watch our Quick Start Guide video or consult our PHIX Cooling Carrier support page.
Design Guidelines for PIC Packaging
This document describes the core design guidelines for photonic integrated circuits (PICs) that will enable PHIX to package your chip into a high performance and cost-effective module that is suitable for a scale-up to volume manufacturing. It will also help you select the standard package type that best suits your needs.