Packaging foundry for photonic ICs
▷ company videoOur offering
Integrated photonics packaging solutions, ranging from single manufacturing steps to complete joint development with manufacturing scale-up.
Contract manufacturing
We can run your integrated photonics and MEMS assembly processes on our machines, with functions ranging from wire bonding to hybrid assembly.
About us
European packaging foundry for all major PIC technology platforms, specialized in hybrid integration, optical assembly, and (RF) electrical connectivity.
Latest news
Learn all about our latest manufacturing solutions, products, people, and industry partnerships.
WHAT WE DO
Manufacturing photonic chip based components and modules in scalable production volumes.
PHIX provides an assembly and packaging service for photonic integrated circuits (PICs). We support chip prototypes as well as high-volume manufacturing and our engineers help optimize your design early on. We are a one-stop shop fully tailored to your needs. That’s how we prepare your products for tomorrow’s society, today.
HOW WE PHIX IT
To integrate PICs into devices, they need to be connected to components like optical fibers, (RF) electronics, and bulk optics with great accuracy. This packaging of our customers’ PICs, either as an outsourced packaging service or as contract manufacturer, is PHIX’s world leading core competence.
- We scale up with your product roadmap, from prototypes to medium and large series
- We support and combine many material platforms, such as silicon photonics, indium phosphide, silicon nitride, lithium niobate, gallium arsenide and ion exchanged glass
- We are your one-stop-shop, by helping you to optimally lay out your PIC with manufacturability and scale-up in mind
- We have a unique process for multi-chip hybrid integration using edge coupling
- We are European based and protect your intellectual property
- We have partnerships with key players in the photonics industry
- We have fiber arrays available for shipment directly from stock
Contract Manufacturing
If you want to outsource your assembly process or you’re looking for a secondary supplier to your own manufacturing, we are your trusted partner and scale up with your growth. We can support you by performing dedicated steps of your production on our equipment. We offer services for (flip chip) die bonding, wire bonding, hybrid assembly, fiber attachment, and more.
Prototype Package
PHIX provides packaging solutions that allow for convenient, quick and affordable prototyping of your first PIC-enabled modules. We have standard package types for various chip dimensions and system configurations. If you have special requirements, we are happy to design a customized package for you.
Volume Package
PHIX has a broad experience in designing and assembling PIC-enabled modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as SiPh, InP, SiN and PLC, and can scale up our production to the volumes your product requires.
PIC Design
Optimizing a PIC based device for performance, robustness, cost-effectiveness, and time to market already begins at the layouting stage of the PIC design. Therefore, to help PIC designers achieve a layout that is set up for packaging success, PHIX is offering a document called “Design Guidelines for Photonic Integrated Circuit Packaging” for free download.
PIC Packaging
Photonic chips need to be interfaced with other components, such as fiber arrays, free space and electronics, before they can find their way into your product. If your PIC-based module is in the prototype phase, our Prototype Packages are an easy and affordable way to test your technology quickly. When your chip is ready for volume production, we provide Volume Packaging services, using our wide experience in various markets.
I would like to know more about PHIX
If you have any enquiries about how we can work together, please get in touch using the contact form below.